Final Program

2023 Final Program

2023 Invited Papers


AuthorAffiliationINVITED PAPER TOPIC
Hanh-Phuc LeUniversity of California San DiegoVertical Power Delivery and Heterogeneous Integration for High-Performance Computing
Dan DenninghoffHRL LaboratoriesAdaptable 40nm GaN T-gate MMIC process for mmW Applications
Venkata VanukuruGlobal FoundriesAnalog/mmWave Circuit Demonstrations in state-of-the-art SiGe BiCMOS process for 5G and Optical Transceivers
Srabanti ChowdhuryStanford UniversityOn extracting the maximum power density at high frequencies from Gallium Nitride and related materials
Ali NiknejadUniversity of California at Berkeley100-200 GHz Wideband Transceivers:  Can CMOS Compete?
Ted LetavicGlobal FoundriesSilicon Photonics
Mike PetersApplied MaterialsSemiconductor Process Tooling for RF Technologies
Tom KaziorDARPAELGAR or other mm-wave programs at Darpa
Joseph CasamentoMITScAlN: Material and Device Aspects
Umesh MishraUniversity of California Santa BarbaraN-polar GaN Devices
Simon MahonMacquarie UniversityTransient Field-Plate Thermometry in Stacked FET Power Amplifiers
Axel TessmannFraunhofer50nm mHEMT developments and results
Hans RohdinBroadcomDevice Modeling for PA Module Design (from device physics to product)
Marvin MarbellWolfspeedSiC IPD modeling from Doherty Design perspective
Guy TorfsGent UniversityHigh Speed SiGe BiCMOS Circuits for Optical Communications
John CresslerGeorgia Institute of TechnologySiGe HBTs for Cryogenic applications – physics, modeling and applications
Thomas ZimmerUniversity of BordeauxReview of methods for thermal resistance determination and extraction
Dr. Mehdi SaliganeUniversity of MichiganMPW and Open Access PDK
Sorin VoinigescuUniversity of TorontoA Circuit Designer’s Perspective on Transistor Modelling Challenges for 6G, Fiberoptics and Quantum Computing Ics